Introduction:
Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc.
It's used in low ionic activator system, tin-run speed
Low level of smoke,surface insulation resistance value is high residue after curing
Therefore, the electrical properties of the cell phones and other communications products, very little interference
Features:
NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR
Recommended for BGA, CSP and other solder ball array repair and fill the ball
When using smoke less, no residue. Affordable.
Suitable for:
North and south bridge, cards, cell phone chip, video chip BGA solder, bumping
Also can use off the tin, the effect is very ideal
The residue was less bright spot, less smoke, no pungent odor, do not run the ball
Package included:
1 x 100g XeredEx NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease